Speaking out, you may not believe that the CPU wafer is the round wafer that is the core material of the CPU. Early computers were very huge. The first generation computers covered an area of 170 square meters and weighed 30 tons. The reduction is entirely due to the invention of semiconductors (the specific principles are encyclopediced by myself). There are quite a lot of semiconducting materials on the earth, and silicon is the semiconductor with the most reserves, the most mature refining technology, and the most stable performance, so it has naturally become the material for CPU. The refining technology of using silicon to make CPU is to provide silicon into high-concentration single crystal silicon, which is then rotated and pulled out from a high-temperature container to become a single crystal silicon ingot. Because the crystal is pulled out when it is pulled out by rotation, it is round. The wafer is the material for making the CPU. The crystal column that is pulled out is cylindrical, and then cut into very thin slices, which are the so-called silicon wafers. The size of the wafer is basically limited by its own characteristics. In the wafer production process, the farther away from the center of the wafer, the more likely it is to have dead pixels. Therefore, expanding from the center of the silicon wafer, the number of dead pixels is on the rise, so that we cannot increase the wafer size as we wish. After the size of the wafer is limited, the etching size becomes the key technology for making the CPU. The smaller the etching size, the more transistors can be engraved. Therefore, the smaller the CPU process, the better the performance of the CPU. Strong. (This is why the photolithography function becomes the key to the performance of the semiconductor chip) The crystal is etched on the wafer in advance, and then cut and processed into a CPU. Don’t underestimate a small square chip on the wafer. , There are billions of transistors on it. In the picture above, you can see that each chip is arranged in a square. In the picture below, assuming that the chips are arranged in other shapes, we can clearly see that the wafer arrangement is arranged in a square form with the highest space utilization. If arranged in a circle, the circle and the There are a lot of gaps between the circles that will be wasted. The wafer is every inch of gold. Think about the etch size and calculate the space in nanometers, so that the arrangement of circles and circles will waste space. When the wafer is cut into chips, it is cut along a straight line. The space utilization of the Tian-shaped arrangement is the highest. Of course, there are also “hexagonal” cutting methods proposed. In theory, this is feasible, but the cost of straight-line cutting Lower. Therefore, considering the comprehensive consideration of effective use of wafer space and cutting cost, the chips that are cut from the top of the wafer are founder chips. This is why the CPU or other electronic circuit board chips are square. Cut out the square Die is cut from the wafer and used to make the CPU. It is called CPU DIE, which is the CPU core. The screenshot of the CPU shown above is cut from the wafer. Is the lower DIE square? The design is more reasonable and uses space. Rate ah More CPU answers can look at these oh, what direction will CPU develop in the future?